Thin film composites in the BiFeO3–Bi4Ti3O12 system obtained by an aqueous solution-gel deposition methodology
[EN] Thin film multiferroic composites, with a high quantity of interfaces between the different materials, represent a more feasible alternative to single phase systems in which the multifunctional response is usually hampered due to intrinsic physical constraints. Nowadays some of these composites...
| Autores: | , , , , , , |
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| Tipo de recurso: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2018 |
| País: | España |
| Institución: | Consejo Superior de Investigaciones Científicas (CSIC) |
| Repositorio: | DIGITAL.CSIC. Repositorio Institucional del CSIC |
| OAI Identifier: | oai:digital.csic.es:10261/201401 |
| Acceso en línea: | http://hdl.handle.net/10261/201401 |
| Access Level: | acceso abierto |
| Palabra clave: | Multiferroics BiFeO3 Thin films Chemical solution deposition Sol–gel spin coating Materiales multiferroicos Láminas delgadas Deposición química en disolución |
| Sumario: | [EN] Thin film multiferroic composites, with a high quantity of interfaces between the different materials, represent a more feasible alternative to single phase systems in which the multifunctional response is usually hampered due to intrinsic physical constraints. Nowadays some of these composites can be produced by applying deposition techniques such as PLD, CVD, MBE or the like, which allow a high degree of crystallographic control. However, despite their effectiveness, all these techniques also involve a high consumption of energy in terms of temperature and/or vacuum. Within this frame, the present contribution proposes a sustainable chemical solution deposition process to prepare thin films of the multiferroic BiFeO–BiTiO composite system. More specifically an aqueous solution-gel plus spin-coating methodology is employed which also avoids the organic solvents typically used in a conventional sol–gel method, so further keeping an eye on the environmentally friendly conditions. Attempts are conducted that demonstrate how by systematically controlling the processing parameters it is possible to obtain thin film composites with a promising 3-3 type connectivity at temperatures as low as 600 °C. |
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