Characterization of sequential dual-curing of thiol-acrylate-epoxy systems with controlled thermal properties
In this work, a novel sequential dual-curing system based on thiol-acrylate-epoxy formulations is developed and characterized. Both reaction stages are thermally activated and sequentially relies on difference in the kinetics of the reactions involved. The viability of this system is successfully te...
| Autores: | , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2019 |
| País: | España |
| Institución: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/133242 |
| Acceso en línea: | https://hdl.handle.net/2117/133242 https://dx.doi.org/10.1016/j.eurpolymj.2018.12.048 |
| Access Level: | acceso abierto |
| Palabra clave: | Polymers Chemistry, Physical and theoretical Dual-curing Click-chemistry Thiol Acrylate Epoxy Functional material Polímers Fisicoquímica Àrees temàtiques de la UPC::Enginyeria química::Química física Àrees temàtiques de la UPC::Enginyeria dels materials::Materials plàstics i polímers |
| Sumario: | In this work, a novel sequential dual-curing system based on thiol-acrylate-epoxy formulations is developed and characterized. Both reaction stages are thermally activated and sequentially relies on difference in the kinetics of the reactions involved. The viability of this system is successfully tested for low curing temperatures and the kinetic of the entire process is completely characterized. Differential scanning calorimetry and Fourier transform infrared spectroscopy analysis revealed an adequate separation between the reactions that leads to a wide interval of time during which the intermediate material can be considered stable. Applicability tests on the resulting thermosets showed the high capability of the intermediate materials to be conformed in complex shapes that can be fixed by means of the second curing stage. This system also shows great potential to be used as adhesive bonding taking advantage of the two-step curing process. |
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