Study of the conductive ink wash-out during overmolding
This study explores the efect of the wash-out of conductive inks used during the in-mold electronic process. The infuence of processing conditions and design parameters on wash-out areas during overmolding is analyzed. Using a comprehensive design of experiments approach, factors like the gate type,...
| Autores: | , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2025 |
| País: | España |
| Institución: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/431524 |
| Acceso en línea: | https://hdl.handle.net/2117/431524 https://dx.doi.org/10.1007/s00170-025-15016-w |
| Access Level: | acceso abierto |
| Palabra clave: | In-mold electronics Overmolding Printed electronics Ink wash-out Flm insert–based technology Polycarbonate Àrees temàtiques de la UPC::Enginyeria dels materials |
| Sumario: | This study explores the efect of the wash-out of conductive inks used during the in-mold electronic process. The infuence of processing conditions and design parameters on wash-out areas during overmolding is analyzed. Using a comprehensive design of experiments approach, factors like the gate type, cavity thickness, melt temperature, injection rate, and mold temperature were evaluated. Three gating types, namely, edge, fan, and submarine, were considered. From the statistical analysis, it was demonstrated that the choice of gating type is the most important factor. Cavity thickness is the second most important factor for all three gating types. Reducing cavity thickness and raising melt temperatures generally led to a decrease in wash-out (WO), whereas the efect of injection rate varied depending on the gating method used. Adjusting mold temperature also produced favorable results, emphasizing the importance of ink-to-substrate adhesion. Simulation studies revealed the relationship between shear rate and wash-out area, underscoring the need to control injection parameters. These fndings stressed the importance of meticulous design and processing to minimize wash-out defects, thus advancing in-mold electronic technology and meeting market demands for complex electronic parts |
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