MicroLED arrays—A perspective beyond displays
MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing...
| Autores: | , , , |
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| Formato: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2024 |
| País: | España |
| Recursos: | Varias* (Consorci de Biblioteques Universitáries de Catalunya, Centre de Serveis Científics i Acadèmics de Catalunya) |
| Repositorio: | Recercat. Dipósit de la Recerca de Catalunya |
| OAI Identifier: | oai:recercat.cat:2445/221109 |
| Acesso em linha: | https://hdl.handle.net/2445/221109 |
| Access Level: | acceso abierto |
| Palavra-chave: | Electrònica Circuits integrats Díodes electroluminescents Electronics Integrated circuits Light emitting diodes |
| Resumo: | MicroLEDs, particularly when integrated with CMOS microelectronics, represent a significant advancement in nitride technology. While large-area, high-power LEDs for solid-state lighting have seen extensive optimization, microLEDs present unique fabrication and characterization challenges. Utilizing standard CMOS design and foundry services for silicon driver electronics, a new hybrid interconnect technology must be developed for chip–chip or wafer–wafer integration, necessitating much higher lateral resolution than current bonding technologies. Beyond display technology, microLED integration opens avenues for groundbreaking applications such as highly efficient nanosensors, miniaturized optical neuromorphic networks, and robust chip-based microscopy. This paper explores recent advancements in nitride/CMOS hybrid modules, providing an overview of current technologies and future possibilities in this dynamic field. |
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