Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals

We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects....

ver descrição completa

Detalhes bibliográficos
Autores: Vera García, María del Carmen, Martínez Fernández, Julián, Singh, M., Casalegno, V., Balagna, C., Ramírez Rico, Joaquín
Formato: artículo
Estado:Versión aceptada para publicación
Fecha de publicación:2020
País:España
Recursos:Universidad de Sevilla (US)
Repositorio:idUS. Depósito de Investigación de la Universidad de Sevilla
OAI Identifier:oai:idus.us.es:11441/142960
Acesso em linha:https://hdl.handle.net/11441/142960
https://doi.org/10.1016/j.matlet.2020.128203
Access Level:acceso abierto
Palavra-chave:Ceramics
Joining
Silicon carbide
Thermal conductivity
id ES_2351f9efbbd7d82d6fb00f056a35d9d4
oai_identifier_str oai:idus.us.es:11441/142960
network_acronym_str ES
network_name_str España
repository_id_str
spelling Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory MetalsVera García, María del CarmenMartínez Fernández, JuliánSingh, M.Casalegno, V.Balagna, C.Ramírez Rico, JoaquínCeramicsJoiningSilicon carbideThermal conductivityWe explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect thermal interface between the two materials, confirming the quality of the obtained brazing layer.Ministerio de Economía y Competitividad MAT2016-76526-RElsevierFísica de la Materia CondensadaMinisterio de Economía y Competitividad (MINECO). España2020info:eu-repo/semantics/articleinfo:eu-repo/semantics/acceptedVersionapplication/pdfapplication/pdfhttps://hdl.handle.net/11441/142960https://doi.org/10.1016/j.matlet.2020.128203reponame:idUS. Depósito de Investigación de la Universidad de Sevillainstname:Universidad de Sevilla (US)InglésMaterials Letters, 276, 128203.MAT2016-76526-Rhttps://dx.doi.org/10.1016/j.matlet.2020.128203info:eu-repo/semantics/openAccessoai:idus.us.es:11441/1429602026-06-17T12:51:07Z
dc.title.none.fl_str_mv Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
title Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
spellingShingle Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
Vera García, María del Carmen
Ceramics
Joining
Silicon carbide
Thermal conductivity
title_short Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
title_full Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
title_fullStr Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
title_full_unstemmed Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
title_sort Microstructure and Thermal Conductivity of Si-Al-C-O Fiber Bonded Ceramics Joined to Refractory Metals
dc.creator.none.fl_str_mv Vera García, María del Carmen
Martínez Fernández, Julián
Singh, M.
Casalegno, V.
Balagna, C.
Ramírez Rico, Joaquín
author Vera García, María del Carmen
author_facet Vera García, María del Carmen
Martínez Fernández, Julián
Singh, M.
Casalegno, V.
Balagna, C.
Ramírez Rico, Joaquín
author_role author
author2 Martínez Fernández, Julián
Singh, M.
Casalegno, V.
Balagna, C.
Ramírez Rico, Joaquín
author2_role author
author
author
author
author
dc.contributor.none.fl_str_mv Física de la Materia Condensada
Ministerio de Economía y Competitividad (MINECO). España
dc.subject.none.fl_str_mv Ceramics
Joining
Silicon carbide
Thermal conductivity
topic Ceramics
Joining
Silicon carbide
Thermal conductivity
description We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect thermal interface between the two materials, confirming the quality of the obtained brazing layer.
publishDate 2020
dc.date.none.fl_str_mv 2020
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/acceptedVersion
format article
status_str acceptedVersion
dc.identifier.none.fl_str_mv https://hdl.handle.net/11441/142960
https://doi.org/10.1016/j.matlet.2020.128203
url https://hdl.handle.net/11441/142960
https://doi.org/10.1016/j.matlet.2020.128203
dc.language.none.fl_str_mv Inglés
language_invalid_str_mv Inglés
dc.relation.none.fl_str_mv Materials Letters, 276, 128203.
MAT2016-76526-R
https://dx.doi.org/10.1016/j.matlet.2020.128203
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:idUS. Depósito de Investigación de la Universidad de Sevilla
instname:Universidad de Sevilla (US)
instname_str Universidad de Sevilla (US)
reponame_str idUS. Depósito de Investigación de la Universidad de Sevilla
collection idUS. Depósito de Investigación de la Universidad de Sevilla
repository.name.fl_str_mv
repository.mail.fl_str_mv
_version_ 1869404634162921472
score 15,198674

Registos relacionados