Monolithic sensor integration in CMOS technologies
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to se...
| Autores: | , , , , , |
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| Tipo de recurso: | artículo |
| Fecha de publicación: | 2022 |
| País: | España |
| Institución: | Universitat Politècnica de Catalunya (UPC) |
| Repositorio: | UPCommons. Portal del coneixement obert de la UPC |
| Idioma: | inglés |
| OAI Identifier: | oai:upcommons.upc.edu:2117/384934 |
| Acceso en línea: | https://hdl.handle.net/2117/384934 https://dx.doi.org/10.1109/JSEN.2022.3224866 |
| Access Level: | acceso abierto |
| Palabra clave: | Metal oxide semiconductors, Complementary CMOS sensors CMOS-micro-electromechanical system (MEMS) Micromachining Monolithic integration System-on-chip (SoC) Metall-òxid-semiconductors complementaris Àrees temàtiques de la UPC::Enginyeria electrònica::Components electrònics |
| Sumario: | © 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
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