Effect of an Anhydride Excess on the Curing Kinetics and Dynamic Mechanical Properties of Synthetic and Biogenic Epoxy Resins

This work analyzes the effect of the anhydride excess on the nonisothermal curing kinetics and on the final properties of synthetic and biobased epoxy resins. Diglycidyl ether of bisphenol A (DGEBA) and epoxidized soybean oil (ESO) were crosslinked using methyltetrahydrophthalic anhydride (MTHPA) as...

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Detalles Bibliográficos
Autores: Altuna, Facundo Ignacio, Riccardi, Carmen Cristina, Marin Quintero, Diana Catalina, Ruseckaite, Roxana Alejandra, Stefani, Pablo Marcelo
Tipo de recurso: artículo
Estado:Versión publicada
Fecha de publicación:2019
País:Argentina
Institución:Consejo Nacional de Investigaciones Científicas y Técnicas
Repositorio:CONICET Digital (CONICET)
Idioma:inglés
OAI Identifier:oai:ri.conicet.gov.ar:11336/119407
Acceso en línea:http://hdl.handle.net/11336/119407
Access Level:acceso abierto
Palabra clave:BIOGENIC EPOXY
DYNAMIC MECHANICAL PROPERTIES
CURING KINETICS
https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
https://purl.org/becyt/ford/1.4
https://purl.org/becyt/ford/1
Descripción
Sumario:This work analyzes the effect of the anhydride excess on the nonisothermal curing kinetics and on the final properties of synthetic and biobased epoxy resins. Diglycidyl ether of bisphenol A (DGEBA) and epoxidized soybean oil (ESO) were crosslinked using methyltetrahydrophthalic anhydride (MTHPA) as a curing agent and 1-methylimidazole (1MI) as an initiator. It was shown that the ESO/MTHPA/1MI system reacts slower than the DGEBA/MTHPA/1MI system, giving place to a more significant evaporation of the curing agent during the reaction. As a result, an excess of anhydride improves the final thermal properties of the ESO/MTHPA/1MI network, contrary to the behavior observed for DGEBA/MTHPA/1MI. The knowledge of the kinetics of the curing process and the optimal amount of the curing agent for each system is of critical importance for a more efficient processing of these materials.