Characterization of thin polycrystalline silicon films deposited on glass by CVD

We deposited polycrystalline silicon (poly-Si) thin films on commercial float glass by chemical vapour deposition from trichlorosilane at temperatures between 735 and 870°C. The structural properties of the films were evaluated by means of scanning electron microscopy, x-ray diffraction, atomic forc...

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Detalhes bibliográficos
Autores: Benvenuto, Ariel Gastón, Buitrago, Roman Horacio, Bhaduri, A., Longeaud, C., Schmidt, Javier Alejandro
Formato: artículo
Estado:Versión publicada
Fecha de publicación:2012
País:Argentina
Recursos:Consejo Nacional de Investigaciones Científicas y Técnicas
Repositorio:CONICET Digital (CONICET)
Idioma:inglés
OAI Identifier:oai:ri.conicet.gov.ar:11336/76424
Acesso em linha:http://hdl.handle.net/11336/76424
Access Level:acceso abierto
Palavra-chave:Polycrystalline Silicon
Electrical Properties
Raman Spectroscopy
https://purl.org/becyt/ford/1.3
https://purl.org/becyt/ford/1
https://purl.org/becyt/ford/2.5
https://purl.org/becyt/ford/2
Descrição
Resumo:We deposited polycrystalline silicon (poly-Si) thin films on commercial float glass by chemical vapour deposition from trichlorosilane at temperatures between 735 and 870°C. The structural properties of the films were evaluated by means of scanning electron microscopy, x-ray diffraction, atomic force microscopy, reflectance in the ultraviolet region and Raman spectroscopy. The electrical characterization involved measurements of dark conductivity and photoconductivity as a function of temperature, Hall effect, ambipolar diffusion length from the steady-state photocarrier grating technique and density of defects by means of modulated photoconductivity. By using boron tribromide as a doping agent, degrees of doping ranging from intrinsic to clearly p-doped were obtained. The process, the reactants and the substrate used are of low cost, and proved to be adequate for direct poly-Si deposition, giving films of good structural and electrical properties.