Effect of oxalate on the growth of cuprous oxide layers on copper electrodes: ellipsometric and isoelectric point study
The effect of the addition of oxalate to the growth of a cuprous oxide layer on copper electrodes was analysed at potential near that of the open circuit, in borax solutions (7 < pH < 9) by cyclic voltammetry, ellipsometry and surface charge techniques. The oxide formation is explained as a se...
| Autores: | , , |
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| Tipo de recurso: | artículo |
| Estado: | Versión publicada |
| Fecha de publicación: | 2009 |
| País: | Argentina |
| Institución: | Consejo Nacional de Investigaciones Científicas y Técnicas |
| Repositorio: | CONICET Digital (CONICET) |
| Idioma: | inglés |
| OAI Identifier: | oai:ri.conicet.gov.ar:11336/159820 |
| Acceso en línea: | http://hdl.handle.net/11336/159820 |
| Access Level: | acceso abierto |
| Palabra clave: | COPPER OXIDE OXALATE ELLIPSOMETRIC ISOELECTRIC POINT https://purl.org/becyt/ford/1.5 https://purl.org/becyt/ford/1 |
| Sumario: | The effect of the addition of oxalate to the growth of a cuprous oxide layer on copper electrodes was analysed at potential near that of the open circuit, in borax solutions (7 < pH < 9) by cyclic voltammetry, ellipsometry and surface charge techniques. The oxide formation is explained as a sequence of Cu2 O layer growth, ippl, cationic defect accumulation and Cu(II) adsorption on the oxide/solution interface, and a dissolution/precipitation step similar to the mechanism previously reported in oxalate free solutions. The oxalate adsorption at pH = 9 increases the dissolution rate and a greater thickness of the outer layer, oppl, is obtained. Nevertheless, the oxalate adsorption at pH = 7 decreases the cationic defect on the cuprous oxide/electrolyte interface, promoting the Cu2 O growth. For copper particles immersed in solutions of pH between 7 and 9, the measured isoelectric point values, iep, (11.8 < iep < 11.5) shifts in the presence of oxalate to pH between 11.6 and 11.0, respectively. This shift in the iep to a lower pH value indicates oxalate adsorption on the Cu/ Cu2 O particles. |
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