Cita APA

Du, X., Yang, Y., Lv, J., Xiang, W., Zhang, D. H., Geng, Q., . . . Cóbreces Álvarez, S. (2026). Terminal-Edge-Cloud Collaborative Temperature Field Reconstruction for Multi-chip IGBT Power Modules in Power Internet of Things.

Citación estilo Chicago

Du, Xingfeng, Yuan Yang, Jiahui Lv, Wei Xiang, Dao Hua Zhang, Qi Geng, Rui Kang, Yang Wen, y Santiago|||0000-0002-3308-4613 Cóbreces Álvarez. Terminal-Edge-Cloud Collaborative Temperature Field Reconstruction for Multi-chip IGBT Power Modules in Power Internet of Things. 2026.

Cita MLA

Du, Xingfeng, et al. Terminal-Edge-Cloud Collaborative Temperature Field Reconstruction for Multi-chip IGBT Power Modules in Power Internet of Things. 2026.