Cita APA

Du, X., Yang, Y., Lv, J., Wen, Y., Zou, S., Wang, Y., & Cóbreces Álvarez, S. (2025). A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction.

Citación estilo Chicago

Du, Xingfeng, Yuan Yang, Jiahui Lv, Yang Wen, Shenglei Zou, Yaxin Wang, y Santiago|||0000-0002-3308-4613 Cóbreces Álvarez. A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based On Copper Substrate Temperature Field Reconstruction. 2025.

Cita MLA

Du, Xingfeng, et al. A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based On Copper Substrate Temperature Field Reconstruction. 2025.